OPP-3DIC™
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OPP-3DIC™
High-Precision Thermal Analysis for Multi-Layer Devices
The OPP-3DIC™ is an advanced optical pump-probe thermal imaging system designed for 3DIC packaging, multi-layer semiconductor devices, and complex thermal structures. This system provides high-resolution, layer-specific thermal characterization to ensure efficient heat dissipation and long-term reliability in densely integrated circuits.
Key Features & Benefits
- Layer-Selective Thermal Analysis – Evaluate individual layers in 3DIC, chiplets, and stacked die architectures.
- Ultra-High Spatial Resolution – Achieve sub-micron precision in thermal mapping.
- Transient & Steady-State Thermal Imaging – Analyze dynamic heat flow and steady-state conditions.
- Failure Detection & Process Optimization – Identify hotspots, material mismatches, and thermal stress.
- Seamless Integration with Semiconductor Testing Systems – Compatible with RF, photonics, and power electronics platforms..
Applications
- 3DIC & Chiplet Packaging – Optimize multi-layer thermal performance and interconnect reliability.
- Advanced Semiconductor Devices – Ensure efficient heat dissipation in high-power components.
- Photonics & Optoelectronics – Evaluate thermal properties of laser diodes, waveguides, and modulators.
- Heterogeneous Integration & MEMS – Analyze heat distribution in microelectromechanical and hybrid systems.
Technical Specifications
- Spatial Resolution: Sub-micron precision
- Temporal Resolution: Nanosecond-scale transient analysis
- Measurement Techniques: Optical pump-probe thermal imaging
- Software Compatibility: Fully integrated with SanjVIEW™ for multi-layer thermal diagnostics
Why Choose SanjSCOPE™ EZ500?
Designed for researchers and engineers who need high-quality thermal imaging at an affordable price, the EZ500 combines ease of use, precision, and reliability in a single system. Whether for failure analysis, product development, or semiconductor testing, this system delivers exceptional results.