POSH-TDTR™
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PS700 POSH-TDTR™
Picosecond Optical Sampling for Heat Transfer Analysis with Time-Domain Thermoreflectance
The PS700 POSH-TDTR™ is a next-generation system designed for fast, accurate, and contactless measurement of thermal properties in both thin films (as thin as 10 nm) and bulk materials. Developed to address the growing thermal challenges in semiconductors, optoelectronics, and heterogeneous integration, it offers advanced capabilities for characterizing heat flow across materials and interfaces.
Key Features & Benefits
- Broad Material Compatibility: Supports Si, SiC, GaAs, diamond, and more
- Rapid Data Acquisition: <2 ms per sweep—no mechanical delay lines
- Automated Analysis: Embedded SanjTHERM™ software for quick, accurate results
- Real-Time Imaging: In-situ laser focus and sample monitoring during measurement
- Seamless Integration with Semiconductor & RF Testing – Compatible with load pull, on-wafer RF, and pulse-IV analysis.
Applications
- 3D/2.5D Semiconductor Packaging: Analyze cross-plane thermal resistance in stacked dies
- Thin-Film Material Research: Characterize thermal conductivity in nanoscale layers
- Interface Engineering: Study bonding layers, barriers, and thermal contact resistance
- High-Performance Electronics: Optimize thermal management for power devices and ICs
Technical Specifications
- Film Thickness Range: ~10 nm to a few microns (material dependent)
- Thermal Conductivity Range: <1 W/m-K to 1000 W/m-K
- Spatial Resolution: 1–20 µm (based on objective)
- Temporal Resolution: 5 ps
Why Choose POSH-TDTR™?
The POSH-TDTR™ system is the gold standard for material thermal characterization, offering unmatched precision, sensitivity, and speed. Designed for researchers and engineers working with emerging materials, this system provides critical insights into heat transport properties, ensuring the development of next-generation thermal solutions.